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1分鐘讓你搞懂台積電的CoWoS背後原理 目前最受矚目先進封裝技術無非台積電的CoWoS技術，CoWoS 主要把晶片堆疊再封裝於基板，形成2.5D甚至3D型態，一分鐘帶你了解背後原理！ #AI #半導體 #cowos #台積電 #摩爾定律 | Technews 科技新報
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