News

Semiconductor Engineering2h
Floorplanning Method Reducing Thermally-Induced Structural Stress In Chiplet Packages (Penn State, Intel, ASU et al.)
Structural and Thermal Aware Methodology for Placement in 2.5D Integration” was published by researchers at Pennsylvania ...
Semiconductor Engineering3h
Embedded GPU: An Open-Source And Configurable RISC-V GPU Platform for TinyAI Devices (EPFL)
An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications” was published by researchers at EPFL.
Semiconductor Engineering17h
Blog Review: May 14
High-voltage PCB spacing; HBM4; AI changes engineering teams; ion beam etching; wafer market and raw materials.