Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution” was published by ...

Defects can show up in the clock trees that drive scan chains, and even inside blocks of scan cells, which may number in the ...

A new technical paper titled “Analyzing Collusion Threats in the Semiconductor Supply Chain” was published by researchers at ...

A Hybrid Approach for Efficient Hardware Security Verification” was published by researchers at RPTU Kaiserslautern-Landau and UC San Diego. “We propose FastPath, a hybrid verification methodology ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

U.S. lifts EDA export restrictions to China; collusion risk in the IC supply chain; Onto buys materials analysis biz; ...

A new technical paper titled “Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal ...

The actual effect is transformative: cycle times that once stretched into weeks shrink to days. By combining the intelligent ...

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

AI drives workflow re-evaluation; DFT verification; hybrid control; managing AI coding agents; 3D-IC structural integrity.

A technical paper titled “Data-driven power modeling and monitoring via hardware performance counter tracking” was published ...

A new technical paper titled “Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes” was published by ...