Abstract: On-board chargers (OBCs) in Electric Vehicles (EVs) have been one of the first applications to drive adoption of SiC MOSFETs. Typically, OBC system designers utilize a TO247 package because ...
Abstract: This paper reports about a novel wafer-level integration technique of discrete surface mount devices (SMDs). It enables wafer-level mounting of plural kinds of SMDs on a silicon (Si)-wafer ...
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