ST offers three antenna-matching chips for STM32WL33 MCUs to simplify development of IoT, smart metering, and remote ...

The expanded in-house wire bonding and die attach suite now includes Hesse Bondjet BJ855 and BJ820 automated wire bonders, Westbond 7KE/7KEH and 7476E/747630E manual wedge, ball, and ribbon bond ...

Modern RF design software integrates AI automation, cloud HPC, and multi-technology workflows to address 5G/6G demands and ...

Device is used to transfer incoming useful intermediate-frequency signal (IF) to high frequencies (RF). Quadrature mixer consists of two double balanc ...

Disruptive Chipset Platform Redefines Satellite Agility, Efficiency, and Sustainability; Enables More than 60% Reductions in Size, Weight, and Cost of Flat Panel Antennas ...

Furthermore, the tool provides the passive component S parameter description file for seamless use in circuit simulations. The tool can be used standalone or integrated with design frameworks, like ...