Process Innovations for Future Technology Nodes with Back-Side Power Delivery and 3D Device Stacking
Abstract: The recent report of a high-yielding process with Back-Side Power Delivery (BSPD) using PowerVia, the benefits obtained on an Intel E-core implementation, and the imminent deployment of ...
The floppy plastic fare card is retiring this month, after three decades of production at this high-security facility in ...
Stanford, CMU, Penn, MIT, and SkyWater Technology reached a major milestone by producing the first monolithic 3D chip ...
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