Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.

LG Innotek (CEO Moon Hyuksoo) announced on December 22 that the company has successfully developed a 'Next-Generation Smart IC (integrated circuit) Substrate' featuring enhanced performance and ...

China has closed a third state-backed investment fund to bolster its semiconductor industry and reduce reliance on other nations, both for using and manufacturing wafers — prioritizing what is called ...