With modern seismic tomography, Earth scientists have discovered that above Earth's core-mantle boundary (CMB), about 2,900 ...

This Application Note illustrates the power dissipation and thermal transfer through the semiconductor package using thermal resistance model, which is critical in considering thermal management to ...

Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical ...

Light undergoes a unique phenomenon called superscattering, an optical illusion where a very small object scatters far more ...

Researchers develop an industry-scalable method to tune thermal conductivity in thin films using femtosecond lasers.

This application note discusses the measurement process and the report of the thermal performance of a small outline SO-5 package. This process used a low conductivity test boards as per JEDEC ...

Femtosecond lasers are turning nanostructures into a new kind of thermal hardware, where heat can be sculpted almost as ...

STACKPOLE CSSU2512 current sense resistor achieves high power density in compact electronic designs with a 5-watt power rating in a standard 2512 footprint.

Achieving high power density in compact electronic designs presents significant engineering challenges. Stackpole addresses ...

NovoLINC's disruptive technology directly addresses the mounting thermal management crisis driven by the explosive power density growth of advanced AI and networking chips. As the industry rapidly ...