PHOENIX--(BUSINESS WIRE)--onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies, today announced that global automotive innovator NIO Inc. chose the latest VE-Tracâ„¢ Direct SiC ...
A stacked DBC packaging method utilizes mutual inductance cancellation effects to significantly reduce parasitic inductance. With the current path increased by one-fold, SiC power modules allow for ...
Developing a power module requires enhanced design and verification methods. Currently, multiple iterations are needed to get the design done. Today, design and manufacturing processes are heavily ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results