SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., a world leader in advanced component solutions, today introduced a new lineup of flip chip LED packages and modules offering ...
iCometrue received enthusiastic responses following its show at SEMICON TAIWAN 2023. Some companies have expressed great interest in iCometrue's Logic Drive and Field Programmable Multi-Chip Package ...
Toshiba Corp. has developed a new chip production technology that increases by 50 percent the number of layers of components that can be crammed inside a standard Multi Chip Package (MCP) for use in ...
The World’s First 0.49mm Fine-Pitch Mini-LED Display Panel Using 36 Pixel-in-1 MiniLED πLED Package.
CHUNAN, Taiwan--(BUSINESS WIRE)-- TSLC Corporation, a vertically integrated LED system manufacturer, introduced the world’s first 0.49mm fine-pitch direct-lit display using 36 pixels-in-1 πLED package ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results