Santa Ana, Calif. — ITT Electronic Components has developed a stacking interconnect system that eliminates up to five different proprietary power and signal cable connectors. Designed for electrically ...

As gigabit line rates become more prevalent in the enterprise market, the need for higher-speed aggregation uplinks are expected to grow at higher than 100% compound annual growth rate over the next ...

Smiths Interconnect has extended its high density modular and mini-modular connectors ranges with the addition of two new types of data transmission modules. Cat5e and Cat6A data transmission modules ...

Smiths Interconnect has announced the extension of its L modular connector Series with the addition of two new module types that complete the company’s wide offering of modular solutions. The L Series ...

The AirMax VS coplanar signal, power, and guidance modules are typically employed as Zone 3 interconnects in next-generation AdvancedTCA carrier-grade communications equipment. The right-angle signal ...

The need for higher bandwidth with efficient connectivity increases as hyperscale data centers transition to faster, flatter, and more scalable network architectures, such as the 2-tier leaf-spine, as ...

LAS VEGAS, NV--(Marketwired - January 05, 2017) - Spectra7 Microsystems Inc. (SEV.TO) ("Spectra7" or the "Company"), a leading provider of high-performance analog ...

For increased current carrying capacity between the backplane and daughter cards in chassis systems, high-power modules have been added to the Metral family of 2-mm backplane connectors. Each module ...

Celestial AI Inc., a startup that develops optical technology for linking together processors and memory modules, has secured $175 million in new funding. The announcement of the Series C round today ...

DDR5 DRAM-based memory module is designed to meet the high-performance demands of data-intensive applications including AI and HPC SEOUL, South Korea--(BUSINESS WIRE)--Samsung Electronics Co., Ltd., ...