Packing more IC functionality into smaller form factors stacks the deck against IC makers and foreshadows difficult interconnect challenges. How much can one package take? As consumer electronics ...
A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications ...
Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. It’s a confusing landscape with a plethora of buzzwords ...
Advanced IC packaging is a prominent technology highlight of the “More than Moore” arena. At a time when chip scaling is becoming more difficult and expensive at each node, engineers are putting ...
The HyperFlash and HyperRAM MCP leverages Cypress's 12-pin HyperBus™ interface and is housed in a 24-ball ball grid array (BGA) package that shares a common footprint with both discrete HyperFlash and ...
Issues in GDDR6 design. In-design analysis for signal integrity and power integrity. Innovative workflow for GDDR6 design and analysis. Graphics processing units (GPUs) and graphics double-data-rate ...
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