Morning Overview on MSN
This new 3D chip could smash AI’s biggest bottleneck
Artificial intelligence has raced ahead so quickly that its biggest constraint is no longer clever algorithms but the ...
A Perspective in National Science Review outlines a new paradigm for fully automated processor chip design. By combining ...
Morning Overview on MSN
MIT finds a new way to pack more transistors on a chip
For decades, chipmakers have squeezed more computing power out of silicon by shrinking transistors, but that strategy is running into hard physical limits. A new approach from MIT aims to sidestep ...
The semiconductor companies and startups on the front lines of the AI chip market are competing over scale as much as anything else. They’re all racing to roll out giant graphics processing units ...
Lam Research is poised for long-term growth due to the increasing demand for 3D NAND, DRAM, and logic chips driven by AI adoption. Regardless of concerns over potential revenue loss from China, Lam's ...
Monolithic integration has been the dominant approach to chip design since the rise of VLSI-based ASICs decades ago. In a monolithic design, all of the building blocks of integrated circuits such as ...
Experts at the Table: Semiconductor Engineering sat down to discuss 3D-IC design challenges and the impact on stacked die on EDA tools and methodologies, with John Ferguson, senior director of product ...
A South Korean logic IC startup is moving closer to cable-free device design with the development of a 60GHz millimeter-wave ...
Semiconductor chiplets represent an advancement in microchip design. They divide traditional monolithic systems into smaller, modular components. Unlike traditional monolithic SoCs, which integrate ...
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