At-speed testing and delay defect analysis have become increasingly critical in ensuring the reliability and performance of modern integrated circuits. As circuit complexity grows alongside rapid ...

Siemens today announced it has acquired ASTER Technologies ("ASTER"), a privately held market leader in printed circuit board ...

MILPITAS, Calif., Dec. 10, 2020 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced two new products: the PWG5™ wafer geometry system and the Surfscan® SP7XP wafer defect inspection system.

Forming circuits involves the use of cylindrical pieces of semiconductor material. These cylinders are sliced into thin, circular pieces known as bare wafers. The bare wafers are then oxidized before ...

MILPITAS, Calif., July 8, 2019 /PRNewswire/ -- Today KLA Corporation (NASDAQ: KLAC) announced the 392x and 295x optical defect inspection systems and the eDR7380™ e-beam defect review system. The new ...

In this article, the most common errors occurring at different stages of the semiconductor fabrication process and the strategies to mitigate them are discussed. The ever-growing complexity of the ...

A technical paper titled “In situ electrical property quantification of memory devices by modulated electron microscopy” was published by researchers at Hitachi High-Tech Corporation, KIOXIA ...

Micro-LED display driven with CuIn5Se8 transistors processed by solution deposition. The LEDs are inorganic making them hard to operate without the power available from devices made with the new ...

A project at MIT has developed a process to integrate atomic-scale defects located in thin slices of diamond, so called "artificial atoms," into photonic circuitry on a larger scale than previously ...